Top 9 Cooling Plaster Cpu

Feature

• Material:Aluminum
• Color:Golden.
• The heatsink with 3M tape,easy to use,strong viscosity.
• Heatsink Dimension:40x40x11mm/1.57×1.57×0.39″.
• Suitable for IC, Diode, Dynatron, Electronic, LED, RAM, CHIP computer’s component heat dissipation or anywhere you need a efficient heatsink.
• You will receive: 2pcs Cooling Heatsinks + 2pcs 3M Silicone Based Thermal Pad.

Feature

• 【Better Heat Dissipation】The cpu cooler comes with 4 heatpipes and 120mm PWM fan to make sure excellent heat transfer from cpu.
• 【PWM Fan】The 120mm PWM fan delivers Low-Noise for automatic speed control and ultra-quiet operation for extreme CPU cooling performance. Max. Air Flow: 76.16CFM
• Noise Level: 15.2-32.5dB(A)
• 【RAM Compatibility】Noninterference with memory mounting even in mini-ITX motherboards.
• 【4 Direct Contact Heat Pipes】4 direct contact heat pipes with exclusive direct contact Technology effectively provide excellent heat dissipation
• 【Compatibility】The CPU air cooler supports most Intel & AMD sockets like Intel Intel LGA2066/2011/1200/1151/1150/1155/1156 and AMD AM4.

Feature

• Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
• Thermal conductivity:&gt
• 1.2W/m-K
• Strength of connected buildings: 55 lb.
• Features: thermal properties, strong adhesion
• Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.

Feature

• TOP TIER THERMAL PERFORMANCE – The IC graphite pad features a thermal conductivity of 35W/m-k.
• EXTRAORDINARY DURABILITY – This thermal pad features a dry solution that contains no liquids. It will not pump or bake out like regular thermal compounds.
• UNMATCHED TEMPERATURE RANGE – Keeps your CPU safe with a temperature operating range of -200C to 400C. RoHS compliant.
• TAKE THE GUESSWORK OUT – The modular solution means never again having to wonder if you’ve applied too much or too little thermal paste.
• REUSABLE – You’ll never have to worry about buying thermal paste ever again. The graphite thermal pad can be reused on multiple builds with no loss in performance.

Feature

• Aluminum Extrusion Design
• Low-profile Gravity i2 has a perfect ratio aluminum extrusion heatsink
• Compatibility: Intel Core i7/i5/i3. Socket LGA1156/1155
• Connector: 4-Pins PWM. Compact Size Fan: 7-bladed 92mm fan provides better cooling performance with low noise
• Quick and easy installation

Feature

• [BETTER THAN LIQUID METAL]: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
• [SAFE APPLICATION]: The MX-4 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
• [HIGH DURABILITY]: In contrast to metal and silicon thermal compound, the MX-4 does not compromise over time. Once applied, you do not need to apply it again as it will last at least for 8 years.
• [EASY TO APPLY]: With an ideal consistency, the MX-4 is very easy to use, even for beginners.
• [THERMAL COMPOUND]: Formula, the MX-4 guarantees exceptional heat dissipation from the components and supports the stability needed to push your system to its limit.

Feature

• Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations
• 4 Direct Contact heat pipes with the patented CDC(Continuous Direct Contact) technology – creating a perfect, sleek surface for heat conduction,Fan Rated Voltage:12V DC,Fan Noise Level:9 – 36 dBA
• Wide-range PWM fan with unique wave-shaped blade design for excellent airflow. AM4 bracket available through Cooler Master USA
• Fan Dimensions: 4.7 x 4.7 x 1 inches. Heat Sink Dimensions: 4.6 x 2.0 x 6.3 inches. Fan Speed: 600 – 2,000 RPM (PWM) ± 10%
• CPU Socket: Intel LGA 2066 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 /
• AMD AM4 / AM3+ / AM3 / AM2 / FM2+ / FM2 / FM1 socket
• Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations.
• 4 Direct Contact heat pipes with the patented CDC (Continuous Direct Contact) technology – creating a perfect, sleek surface for heat conduction.
• Wide-range PWM fan with unique wave-shaped blade design for excellent airflow.
• Versatile all-in-one mounting solution supporting the Intel: LGA 2011, 1366, 1151, 1150, 1155, 1156, 775,AMD: FM2+, FM2, FM1, AM3+, AM3, AM2+, AM2, AM1.
• Fan Dimensions:120 x 120 x 25 mm (4.7 x 4.7 x 1 in).
• Heatsink Dimensions: 116 x 51 x 159 mm (4.6 x 2 x 6.2 in).

Feature

• 3rd Generation Dual Chamber Pump for overall cooling efficiency and performance
• New SickleFlow Refreshed exterior design for improved lighting and fan blades for a quiet airflow performance
• RGB Lighting Signature cooling performance with a RGB design for all of the users wanting lighting effects that are fully customizable
• Larger Surface Area Increased the surface area of the fins on the radiator for better heat dissipation
• Industrial Grade Seal High Industrial Grade EPDM material to strengthen the seal for improved longevity and Anti-Leaking
• Controller Included a wired RGB Controller
• CPU Socket Support: LGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1151, LGA1150, LGA1156, LGA1155, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1

Feature